Oxford CMI 563 | |||||||||||||||
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Oxford/CMI CMI 563
Oxford Instruments CMI-563 measures surface copper thickness applications to serve the quality control needs of the Printed Circuit Board industry.
· Measures the thickness of copper foil on rigid, flexible, single- and double-sided or multi-layer PCBs
· Measures foil or laminated copper thickness in mils or µm
· Sorts copper by weight at incoming inspection, before drilling, shearing or plating
· Determines electroless or electroplated Cu thickness on PCBs
· Accurately quantifies copper thickness after etching or planarizing
· Verifies copper plating thickness on PCB surface
The probe utilizes Oxford Instruments proprietary SRP-4 microresistance technology, featuring economical user-replaceable measurement tips.
Features:
· Rugged hand-held 16-button unit featuring a large 4-digit LCD display
· Features Oxford Instruments proprietary, economical, user-replaceable SRP-4 probe tips that can be easily replaced on site minimizing downtime
· Contains fine-line measurement algorithm for measuring on Cu traces
· RS-232 serial port output for a printer or PC download
· Statistical data analysis and reporting with memory location, number of readings, Cu type, date-time stamping, mean, standard deviation, accuracy, high, low, range, cpk, and histogram
Includes: Hand held unit with carry case, measurement probe and NIST traceable calibration standards
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Thông tin liên hệ:
Mr.Hiện Hp: (+84)-965546820
Skype: Tran Ba Hien , Zalo: 01639674668
Email : bahien.ntd@gmail.com
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